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PEG (Thiol)2
产品代号:
HS-PEG-SH
产品纯度:
≥ 95%
包装规格:
1g, 10g, 100g等(特殊包装需收取分装费用)
分子量:
3500 Da, 5000 Da等
关键词:
所属分类:
科研客户小批量一键采购地址(小于5克)
- 产品描述
- 参考文献
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键凯科技生产的高品质双端巯基聚乙二醇产品可以在温和反应条件下有选择性地与半胱氨酸侧链上的硫基团发生反应的PEG。键凯科技的同双功能PEG衍生物可作为交联剂广泛应用于蛋白质和肽的PEG修饰、纳米颗粒及表面改性中。与使用线性PEG修饰的微粒相比,与同双功能PEG缀合的颗粒可保证更高的载药量。
键凯科技提供分装服务,需要收取分装费用,如果您需要分装为其他规格请与我们联系。
键凯科技同时提供其他分子量的HS-PEG-SH衍生物产品,如你需要请与我司[email protected]联系。
键凯科技提供大批量生产产品及GMP级别产品,如需报价请与我们联系。
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References:
- Truong, N.F., et al., Microporous annealed particle hydrogel stiffness, void space size, and adhesion properties impact cell proliferation, cell spreading, and gene transfer, Acta Biomaterialia, 2019.
- Zhang, J., et al, Insight into the role of grafting density in the self-assembly of acrylic acid-grafted-collagen, International Journal of Biological Macromolecules, 2019.
- Bae, S.W., et al., Dynamic, Bioresponsive Hydrogels via Changes in DNA Aptamer Conformation, Macromolecular bioscience, 2019, 19(2):1800353.
- Wehrman, M.D., et al., Rheological properties and structure of step‐and chain‐growth gels concentrated above the overlap concentration. AIChE Journal, 2017.
- Kozai, T.D.Y, et al., Two-photon imaging of chronically implanted neural electrodes: Sealing methods and new insights, Journal of Neuroscience Methods, 2016, 258, P. 46-55.
- Sridhar, B. V., et al., Development of a Cellularly Degradable PEG Hydrogel to Promote Articular Cartilage Extracellular Matrix Deposition. Advanced Healthcare Materials, 2015, 4: 702–713.
- Sridhar, B.V., et al., Covalently tethered TGF-β1 with encapsulated chondrocytes in a PEG hydrogel system enhances extracellular matrix production. Journal of Biomedical Materials Research Part A, 2014.
- Liu, S., et al., Effects of the proportion of two different cross-linkers on the material and biological properties of enzymatically degradable PEG hydrogels, Polymer Degradation and Stability, 2020, V. 172.
- He, Y., et al, Thiol-ene-mediated degradable POSS-PEG/PEG hybrid hydrogels as potential cell scaffolds in tissue engineering, Polymer Degradation and Stability, 2023, V. 211.
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